arXiv 2025 SaraerToosi, Tu et al.
Focused publications
Earth system science through advanced computational imaging, remote sensing, and machine learning. We study the atmosphere, oceans, weather, and climate using satellite observations, physics-based inference, and data-driven methods to improve environmental understanding, monitoring, and prediction.
| Date | Title | First Authors | Venue |
|---|---|---|---|
| Jul 2025 | Neural Dynamic Modes: Computational Imaging of Dynamical Systems from Sparse Observations Ali SaraerToosi, Renbo Tu, Kamyar Azizzadenesheli, Aviad Levis | SaraerToosi, Tu et al. | arXiv |
| Apr 2025 | 3D Volumetric Tomography of Clouds Using Machine Learning for Climate Analysis Roi Ronen, Ilan Koren, Aviad Levis, Eshkol Eytan, Vadim Holodovsky, Yoav Y. Schechner | Ronen et al. | Scientific Reports |
| 2023 | Retrieving 3D distributions of atmospheric particles using Atmospheric Tomography with 3D Radiative Transfer – Part 1: Model description and Jacobian calculation Jesse Loveridge, Aviad Levis, Larry Di Girolamo, Vadim Holodovsky, Linda Forster, Anthony B. Davis, Yoav Y. Schechner | Loveridge, Levis et al. | Atm. Meas. Tech. |
| 2023 | Retrieving 3D distributions of atmospheric particles using Atmospheric Tomography with 3D Radiative Transfer – Part 2: Local optimization Jesse Loveridge, Aviad Levis, Larry Di Girolamo, Vadim Holodovsky, Linda Forster, Anthony B. Davis, Yoav Y. Schechner | Loveridge, Levis et al. | Atm. Meas. Tech. |
| 2020 | Multi-View Polarimetric Scattering Cloud Tomography and Retrieval of Droplet Size Aviad Levis, Yoav Y. Schechner, Anthony B. Davis, Jesse Loveridge | Levis et al. | Remote Sensing |
| 2018 | Statistical Tomography of Microscopic Life Aviad Levis, Yoav Y. Schechner, Ronen Talmon | Levis et al. | Proc. IEEE CVPR |
| 2017 | Multiple-Scattering Microphysics Tomography Aviad Levis, Yoav Y. Schechner, Anthony B. Davis | Levis et al. | Proc. IEEE CVPR |
| 2015 | Airborne Three-Dimensional Cloud Tomography Aviad Levis, Yoav Y. Schechner, Amit Aides, Anthony B. Davis | Levis et al. | Proc. IEEE ICCV |