arXiv 2025 SaraerToosi, Tu et al.
Focused publications
Multi-angle, multi-spectral polarimetric sensing to infer 3D structure, microphysics, and environmental processes across Earth’s atmosphere and oceans. We develop radiative-transfer–driven reconstruction methods for inverse problems, enabling improved climate understanding and environmental monitoring.
| Date | Title | First Authors | Venue |
|---|---|---|---|
| Jul 2025 | Neural Dynamic Modes: Computational Imaging of Dynamical Systems from Sparse Observations Ali SaraerToosi, Renbo Tu, Kamyar Azizzadenesheli, Aviad Levis | SaraerToosi, Tu et al. | arXiv |
| Apr 2025 | 3D Volumetric Tomography of Clouds Using Machine Learning for Climate Analysis Roi Ronen, Ilan Koren, Aviad Levis, Eshkol Eytan, Vadim Holodovsky, Yoav Y. Schechner | Ronen et al. | Scientific Reports |
| 2023 | Retrieving 3D distributions of atmospheric particles using Atmospheric Tomography with 3D Radiative Transfer – Part 1: Model description and Jacobian calculation Jesse Loveridge, Aviad Levis, Larry Di Girolamo, Vadim Holodovsky, Linda Forster, Anthony B. Davis, Yoav Y. Schechner | Loveridge, Levis et al. | Atm. Meas. Tech. |
| 2023 | Retrieving 3D distributions of atmospheric particles using Atmospheric Tomography with 3D Radiative Transfer – Part 2: Local optimization Jesse Loveridge, Aviad Levis, Larry Di Girolamo, Vadim Holodovsky, Linda Forster, Anthony B. Davis, Yoav Y. Schechner | Loveridge, Levis et al. | Atm. Meas. Tech. |
| 2020 | Multi-View Polarimetric Scattering Cloud Tomography and Retrieval of Droplet Size Aviad Levis, Yoav Y. Schechner, Anthony B. Davis, Jesse Loveridge | Levis et al. | Remote Sensing |
| 2018 | Statistical Tomography of Microscopic Life Aviad Levis, Yoav Y. Schechner, Ronen Talmon | Levis et al. | Proc. IEEE CVPR |
| 2017 | Multiple-Scattering Microphysics Tomography Aviad Levis, Yoav Y. Schechner, Anthony B. Davis | Levis et al. | Proc. IEEE CVPR |
| 2015 | Airborne Three-Dimensional Cloud Tomography Aviad Levis, Yoav Y. Schechner, Amit Aides, Anthony B. Davis | Levis et al. | Proc. IEEE ICCV |